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IPC-A-600K, Acceptability of Printed Boards

20. July 2020

IPC Association has released IPC-A-600K, Acceptability of Printed Boards, the definitive illustrated guide to printed circuit board acceptability. This companion document to IPC-6012, Qualification and Performance Specification for Rigid Printed Boards and IPC-6013, Qualification and Performance Specification for Flexible Printed Boards, provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards.


Along with descriptions for target, acceptable, and nonconforming conditions that are either externally or internally observable on printed boards, this document provides many updates, including:  

  • Updated Pattern Definitions – Conductor Width, External Annular Ring, Surface Plating
  • Updated Dielectric Materials – Laminate Voids/Cracks, Smear Removal, Negative Etchback, Layer-to-Layer Spacing
  • Conductive Patterns – Overhang, External Conductive Plating (Foil Plus Plating), Solder Mask Thickness
  • Significant Changes to Section on Plated-Through Hole - Microvia Target Land Contact Dimension, Copper Wrap Plating, Copper Cap Plating, Plated Copper Filled Vias, Back-Drilled Holes
  • Significant Changes to Metal Core Printed Boards
  • Updated Solderability Testing Crazing Penetration Criteria Updated
  • Changes to Acceptance for Base Material Surfaces

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